3D interconnects and multi-module integrated surface electrode ion trap for scalable quantum information processing

• المؤلف الرئيسي: Zhao, Peng
• مؤلفون آخرون: Tan Chuan Seng
• التنسيق: Thesis-Doctor of Philosophy
• اللغة: English
• منشور في: Nanyang Technological University 2022
• الموضوعات: Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/160146
• المؤسسة: Nanyang Technological University

Among the various physical systems for quantum bit (qubit) implementation, trapped ion has drawn significant attention due to its long coherence time (in the second range) and high gate fidelity (>99.99% for single qubit gate). After years of careful development, the ion trap, from mechanically a...