Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging

• المؤلفون الرئيسيون: He, Hongying, Peng, Weixiang, Liu, Junbo, Chan, Xin Ying, Liu, Shike, Lu, Li, Le Ferrand, Hortense
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2022
• الموضوعات: Engineering::Mechanical engineering; Directional Heat Dissipation; Boron Nitride Composites; High Thermal Conductivity; Microstructure Design
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/161062

Miniaturized and high-power density 3D electronic devices pose new challenges on thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is currently limited by the thermal conductivity achieved by thermal interface materials (TIMs) and by their capability to direct...