Text this: Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging

  ____       ___                 ___              
 |  _ \\    / _ \\      ___     / _ \\    ____    
 | |_| ||  | / \ ||    /   ||  | / \ ||  |    \\  
 | .  //   | \_/ ||   | [] ||  | \_/ ||  | [] ||  
 |_|\_\\    \___//     \__ ||   \___//   |  __//  
 `-` --`    `---`       -|_||   `---`    |_|`-`   
                         `-`             `-`