Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging

• Main Authors: He, Hongying, Peng, Weixiang, Liu, Junbo, Chan, Xin Ying, Liu, Shike, Lu, Li, Le Ferrand, Hortense
• 其他作者: School of Mechanical and Aerospace Engineering
• 格式: Article
• 語言: English
• 出版: 2022
• 主題: Engineering::Mechanical engineering; Directional Heat Dissipation; Boron Nitride Composites; High Thermal Conductivity; Microstructure Design
• 在線閱讀: https://hdl.handle.net/10356/161062

Miniaturized and high-power density 3D electronic devices pose new challenges on thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is currently limited by the thermal conductivity achieved by thermal interface materials (TIMs) and by their capability to direct...