A general solution to the maximum detachment force in thin film peeling

• المؤلفون الرئيسيون: Yin, Hanbin, Peng, Zhilong, Yao, Yin, Chen, Shaohua, Gao, Huajian
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2022
• الموضوعات: Engineering::Mechanical engineering; Film-Substrate System; Maximum Detachment Force
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/163905

While it is well known that the steady-state detachment force during 90° peeling of an elastic film on a rigid substrate provides a simple and powerful method to determine the interfacial work of adhesion, the situation is less clear for the maximum detachment force associated with the peeling proce...