Influence of the interface temperature on the damage morphology and material transfer of C–Cu sliding contact under different current amplitudes

• Main Authors: Wang, Hong, Gao, Guoqiang, Wei, Wenfu, Yang, Zefeng, Yin, Guofeng, Xie, Wenhan, He, Zhijiang, Ni, Ziran, Yang, Yan, Wu, Guangning
• 其他作者: School of Electrical and Electronic Engineering
• 格式: Article
• 語言: English
• 出版: 2023
• 主題: Engineering::Electrical and electronic engineering; Wear Behaviors; Arc-Discharge
• 在線閱讀: https://hdl.handle.net/10356/164023

The influence of interface temperature on the damage characteristics of C–Cu contacts’ interface plays a critical role in the current-carrying friction process which occurs between the contact pairs. In this paper, a method is proposed to adjust the interface temperature via settling an external hea...