Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites

• المؤلفون الرئيسيون: Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2023
• الموضوعات: Engineering::Electrical and electronic engineering; Composite Failure; Thermal Shock Resistance
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/164340
• المؤسسة: Nanyang Technological University

Carbon/aluminium (C/Al) composites have the advantages of low density and high electrical conductivity, which have potential applications in aerospace, rail transportation and other fields. However, the unstable bonding of the C/Al interface and significant thermal expansion differences have resulte...