High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

• المؤلفون الرئيسيون: Fan, Jiajie, Jiang, Dawei, Zhang, Hao, Hu, Dong, Liu, Xu, Fan, Xuejun, Zhang, Guoqi
• مؤلفون آخرون: School of Materials Science and Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2023
• الموضوعات: Engineering::Materials; Power Electronics Packaging; Nano-Copper Sintering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/164880

Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered...