Controlled distributed Ti₃C₂Tx hollow microspheres on thermally conductive polyimide composite films for excellent electromagnetic interference shielding

Controlled distributed Ti₃C₂Tx hollow microspheres on thermally conductive polyimide composite films for excellent electromagnetic interference shielding

Flexible multifunctional polymer-based electromagnetic interference (EMI) shielding composite films have important applications in the fields of 5G communication technology, wearable electronic devices, and artificial intelligence. Based on the design of a porous/multilayered structure and using pol...

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Bibliographic Details
Main Authors: Zhang, Yali, Ruan, Kunpeng, Zhou, Kun, Gu, Junwei
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2023
Subjects:
Engineering::Mechanical engineering
Electromagnetic Interference Shielding
Thermal Conductivity
Online Access:https://hdl.handle.net/10356/166410
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Institution: Nanyang Technological University
Language: English
Description
Summary:Flexible multifunctional polymer-based electromagnetic interference (EMI) shielding composite films have important applications in the fields of 5G communication technology, wearable electronic devices, and artificial intelligence. Based on the design of a porous/multilayered structure and using polyimide (PI) as the matrix and polymethyl methacrylate (PMMA) microspheres as the template, flexible (Fe3 O4 /PI)-Ti3 C2 Tx -(Fe3 O4 /PI) composite films with controllable pore sizes and distribution of Ti3 C2 Tx hollow microspheres are successfully prepared by sacrificial template method. Owing to the porous/multilayered structure, when the pore size of the Ti3 C2 Tx hollow microspheres is 10 µm and the mass ratio of PMMA/Ti3 C2 Tx is 2:1, the (Fe3 O4 /PI)-Ti3 C2 Tx -(Fe3 O4 /PI) composite film has the most excellent EMI shielding performance, with EMI shielding effectiveness (EMI SE) of 85 dB. It is further verified by finite element simulation that the composite film has an excellent shielding effect on electromagnetic waves. In addition, the composite film has good thermal conductivity (thermal conductivity coefficient of 3.49 W (m·K)-1 ) and mechanical properties (tensile strength of 65.3 MPa). This flexible (Fe3 O4 /PI)-Ti3 C2 Tx -(Fe3 O4 /PI) composite film with excellent EMI shielding performance, thermal conductivity, and mechanical properties has demonstrated great potential for applications in EMI shielding protection for high-power, portable, and wearable flexible electronic devices.

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