Embedded on-board passive devices for integrated switched-mode converters

• Main Author: Lee, Jinhen
• Other Authors: Chang Joseph
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2023
• Subjects: Engineering::Electrical and electronic engineering::Microelectronics; Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• Online Access: https://hdl.handle.net/10356/167554
• Institution: Nanyang Technological University

The passive devices in state-of-the-art miniaturized switched-mode DC-DC converters are generally integrated by means of on-chip and in-package methods. Nevertheless, the quality is poor-to-moderate, thereby compromising the power-efficiency. In this project, the miniaturization of the DC-DC converter is achieved by realizing its passive devices as embedded devices that are printed within a high-density 3D inkjet printed-circuit-board (PCB). A fourth-order stacked LC filter is proposed, embodying passive components with small values—effectively at no additional cost because they are embedded through 3D-printing. For the inductor and capacitor, a high-Q solenoidal structure and the metal-insulator-metal planar structure are respectively adopted. The proposed filter is printed within the 3D-PCB with a compact 124 mm3 volume due to the stacked arrangement. The measured AC attenuation is 21.2 dB at 200 MHz. The filter is further verified by means of computer simulations of a DC-DC buck converter. Simulation results of the converter employing the filter show a low output voltage ripple at 146 mV and a high peak power-efficiency of ~78% at 200 MHz switching frequency with 150 mA load current.