Hydrogels for flexible electronics

• Main Authors: Zhang, Yingchao, Tan, Yurong, Lao, Jia Zheng, Gao, Huajian, Yu, Jing
• Other Authors: School of Materials Science and Engineering
• Format: Article
• Language: English
• Published: 2023
• Subjects: Engineering::Materials; Flexible Electronics; Hydrogels; Mechanical Properties; Adhesion; Conductivity
• Online Access: https://hdl.handle.net/10356/169207
• Institution: Nanyang Technological University

Hydrogels have emerged as promising materials for flexible electronics due to their unique properties, such as high-water content, softness, and biocompatibility. In this perspective, we provide an overview of the development of hydrogels for flexible electronics, with a focus on three key aspects: mechanical properties, interfacial adhesion, and conductivity. We discuss the principles of designing high-performance hydrogels and present representative examples of their potential applications in the field of flexible electronics for healthcare. Despite significant progress, several challenges remain, including improving the anti-fatigue capability, enhancing interfacial adhesion, and balancing water content in wet environments. Additionally, we highlight the importance of considering the hydrogel-cell interactions and the dynamic properties of hydrogels in future research. Looking ahead, the future of hydrogels in flexible electronics is promising, with exciting opportunities on the horizon, but continued investment in research and development is necessary to overcome the remaining challenges.