Tian, Y., Kripalani, D. R., Xue, M., Zhou, K., & Engineering, S. o. M. a. A. (2023). Fermi level depinning via insertion of a graphene buffer layer at the gold-2D tin monoxide contact.
استشهاد بنمط شيكاغوTian, Yujia, Devesh R. Kripalani, Ming Xue, Kun Zhou, و School of Mechanical and Aerospace Engineering. Fermi Level Depinning Via Insertion of a Graphene Buffer Layer At the Gold-2D Tin Monoxide Contact. 2023.
MLA استشهادTian, Yujia, et al. Fermi Level Depinning Via Insertion of a Graphene Buffer Layer At the Gold-2D Tin Monoxide Contact. 2023.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.