Fused filament fabrication of conductive polymer on textile for wearable

This study investigates the application of conductive filaments through 3D printing, specifically utilizing Fused Filament Fabrication (FFF) printers, on diverse fabric types. The growing interest in smart textiles and flexible electronics has spurred advancements in material science and manufacturi...

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Bibliographic Details
Main Author: Raguraman Gunasellan
Other Authors: Yeong Wai Yee
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2023
Subjects:
Online Access:https://hdl.handle.net/10356/172896
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Institution: Nanyang Technological University
Language: English
Description
Summary:This study investigates the application of conductive filaments through 3D printing, specifically utilizing Fused Filament Fabrication (FFF) printers, on diverse fabric types. The growing interest in smart textiles and flexible electronics has spurred advancements in material science and manufacturing. However, a critical knowledge gap exists regarding the adhesion dynamics of 3D printed conductive filaments to various fabric types, particularly with different weave patterns. Understanding these dynamics is crucial for establishing reliable connections in applications like wearable technology and medical devices, making it necessary to bridge these gaps for the broader field's benefit. The primary objective of this research is to understand the adhesion characteristics between conductive soft print filaments and different fabric types. The study aims to refine techniques for optimal outcomes by systematically optimizing printing parameters, exploring various stitching patterns and fabric compositions, and investigating their impact on adhesion. Comprehensive analysis and categorization of factors influencing adhesion are conducted to uncover the intricate relationship between 3D printed conductive filaments and fabric substrates. To achieve these goals, microscopic imaging is employed to observe and analyse weave patterns, and the tensile peel test is utilized to measure bonding strength between printed filaments and various types of fabric substrates. Notably, the study identifies Polka and Denim weave patterns as exhibiting the strongest adhesion. Additionally, the research explores the correlation between fabric surface roughness (characterized by Ra values of 80 µm or greater, Rq values of 95 µm or more, or Rz values of 600 µm or above) and adhesion strength. When specific print parameters, such as a temperature of 240°C and a 110% flow rate, are combined, there is a significant improvement in adhesion between conductive TPU and fabric. These findings offer profound insights into the intricate interaction between 3D printed filaments and different fabric types, paving the way for more robust applications in conductive filaments and fabric integration in various technological domains.