Effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis

The thermal management requirement of the servers for data centers has become an urgent issue to be addressed. The two-phase compact thermosyphon has been one of the highly-efficient passive cooling devices to solve heat dissipation problems. In this study, compact thermosyphons with different heigh...

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Main Authors: Qin, Siyu, Liu, Yijia, Ji, Ruiyang, Zhang, Haitao, Jin, Liwen, Yang, Chun, Meng, Xiangzhao
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2024
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Online Access:https://hdl.handle.net/10356/173238
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1732382024-01-22T01:08:30Z Effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis Qin, Siyu Liu, Yijia Ji, Ruiyang Zhang, Haitao Jin, Liwen Yang, Chun Meng, Xiangzhao School of Mechanical and Aerospace Engineering Engineering::Mechanical engineering Thermal Management Compact Thermosyphon The thermal management requirement of the servers for data centers has become an urgent issue to be addressed. The two-phase compact thermosyphon has been one of the highly-efficient passive cooling devices to solve heat dissipation problems. In this study, compact thermosyphons with different heights (20 mm, 25 mm, and 50 mm) and filling ratios (25 % − 75 %) were investigated. The corresponding boiling curves and thermal performance were analyzed. Thermal resistance was defined to evaluate the thermal performance in the thermosyphon system. The experimental results illustrate that the reduction in height significantly influences the thermal behaviors of the compact thermosyphon. For the 20 mm height case, the bubble adheres to the condensation surface for a longer time compared with the other cases, which increases the entire bubble growth period. Boiling curves of compact thermosyphons with different heights and filling ratios exhibit distinct characteristics. The heat flux on the boiling surface (qb) with 20 mm height at the low filling ratio (FR = 25 %) is 68.2 % of that with the 50 mm height, indicating the reduced boiling intensity. Both the delayed onset of boiling (ONB) and bubble films of large areas on the condensation surface are generated at FR = 75 % case with 20 mm height, which weakens the phase change heat transfer. For the 50 mm height case, a medium filling ratio and lower input heat flux provide the optimized performance (0.36 K·W−1 of the thermal resistance). For the compact thermosyphon with lower height, low and medium filling ratios are preferred to minimize the deterioration of thermal performance. The outcomes are hoped to provide references for the optimal design and operation of the compact thermosyphon applied in the areas of thermal management and energy conservation. This work is supported by the National Natural Science Foundation of China (52376073), Key Research and Development Program of Shaanxi (2023-GHZD-54), Shaanxi Postdoctoral Science Foundation (2023BSHEDZZ51) and the China Postdoctoral Science Foundation (2023M742802). 2024-01-22T01:08:30Z 2024-01-22T01:08:30Z 2024 Journal Article Qin, S., Liu, Y., Ji, R., Zhang, H., Jin, L., Yang, C. & Meng, X. (2024). Effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis. Applied Thermal Engineering, 240, 122142-. https://dx.doi.org/10.1016/j.applthermaleng.2023.122142 1359-4311 https://hdl.handle.net/10356/173238 10.1016/j.applthermaleng.2023.122142 2-s2.0-85180411375 240 122142 en Applied Thermal Engineering © 2023 Elsevier Ltd. All rights reserved.
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Mechanical engineering
Thermal Management
Compact Thermosyphon
spellingShingle Engineering::Mechanical engineering
Thermal Management
Compact Thermosyphon
Qin, Siyu
Liu, Yijia
Ji, Ruiyang
Zhang, Haitao
Jin, Liwen
Yang, Chun
Meng, Xiangzhao
Effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis
description The thermal management requirement of the servers for data centers has become an urgent issue to be addressed. The two-phase compact thermosyphon has been one of the highly-efficient passive cooling devices to solve heat dissipation problems. In this study, compact thermosyphons with different heights (20 mm, 25 mm, and 50 mm) and filling ratios (25 % − 75 %) were investigated. The corresponding boiling curves and thermal performance were analyzed. Thermal resistance was defined to evaluate the thermal performance in the thermosyphon system. The experimental results illustrate that the reduction in height significantly influences the thermal behaviors of the compact thermosyphon. For the 20 mm height case, the bubble adheres to the condensation surface for a longer time compared with the other cases, which increases the entire bubble growth period. Boiling curves of compact thermosyphons with different heights and filling ratios exhibit distinct characteristics. The heat flux on the boiling surface (qb) with 20 mm height at the low filling ratio (FR = 25 %) is 68.2 % of that with the 50 mm height, indicating the reduced boiling intensity. Both the delayed onset of boiling (ONB) and bubble films of large areas on the condensation surface are generated at FR = 75 % case with 20 mm height, which weakens the phase change heat transfer. For the 50 mm height case, a medium filling ratio and lower input heat flux provide the optimized performance (0.36 K·W−1 of the thermal resistance). For the compact thermosyphon with lower height, low and medium filling ratios are preferred to minimize the deterioration of thermal performance. The outcomes are hoped to provide references for the optimal design and operation of the compact thermosyphon applied in the areas of thermal management and energy conservation.
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Qin, Siyu
Liu, Yijia
Ji, Ruiyang
Zhang, Haitao
Jin, Liwen
Yang, Chun
Meng, Xiangzhao
format Article
author Qin, Siyu
Liu, Yijia
Ji, Ruiyang
Zhang, Haitao
Jin, Liwen
Yang, Chun
Meng, Xiangzhao
author_sort Qin, Siyu
title Effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis
title_short Effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis
title_full Effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis
title_fullStr Effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis
title_full_unstemmed Effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis
title_sort effect of compact thermosyphon height on boiling curve and thermal performance: a visualization analysis
publishDate 2024
url https://hdl.handle.net/10356/173238
_version_ 1789483108615061504