Multi-material heterogeneous integration on a 3-D photonic-CMOS platform

• Main Authors: Ranno, Luigi, Sia, Brian Jia Xu, Dao, Khoi, Phuong, Hu, Juejun
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2024
• Subjects: Engineering; Oxide semiconductors; Silicon wafers
• Online Access: https://hdl.handle.net/10356/173571
• Institution: Nanyang Technological University

Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been achieved at low costs. However, some functionalities, such as op...