Fabrication and testing of composites with oriented microstructures
Electronic system design has been requiring critical attention and consideration especially since devices have been increasingly densely packaged. Effective heat dissipation and regulation is a crucial factor in system design to guarantee excellent device performance. Thermal Interface Materials (TI...
Saved in:
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Final Year Project |
| 語言: | English |
| 出版: |
Nanyang Technological University
2024
|
| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/176047 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|