Heat conduction across interface between two materials. Part I: perfectly conducting interface

• Main Author: Tan, Louis Jun Wei
• Other Authors: Ang Whye-Teong
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2024
• Subjects: Engineering; Heat transfer
• Online Access: https://hdl.handle.net/10356/176516
• Institution: Nanyang Technological University

This document introduces a mathematical framework to describe steady, two-dimensional heat conduction in rectangular coordinates. The formulation utilizes the Fourier heat conduction equation, incorporating considerations for thermal conductivity and boundary conditions. The numerical solution involves expanding the Fourier heat conduction equation through the separation of variables and trigonometric Fourier series. The results are visually represented using contour plots and heat maps to display the temperature distribution. Model validation is conducted by comparing numerical results with analytical solutions applicable to simple geometries. The report acknowledges limitations, such as the exclusion of convection and radiation and the assumption of steady state conditions. Despite these limitations, the model is positioned as a valuable tool for predicting temperature distributions in complex geometries, facilitating the design and optimization of heat transfer systems.