Design optimization and experimental investigation of PCM-based heat sink for thermal energy storage
Thermal energy storage (TES) systems can be enhanced by combining the benefits of phase change materials (PCM) with topologically optimized (TO) heat sinks. By utilizing the high latent heat of fusion of PCM in the melting process, thermal energy can be stored more effectively. TO heat sinks designe...
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Format: | Final Year Project |
Language: | English |
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Nanyang Technological University
2024
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Online Access: | https://hdl.handle.net/10356/176717 |
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Institution: | Nanyang Technological University |
Language: | English |
Summary: | Thermal energy storage (TES) systems can be enhanced by combining the benefits of phase change materials (PCM) with topologically optimized (TO) heat sinks. By utilizing the high latent heat of fusion of PCM in the melting process, thermal energy can be stored more effectively. TO heat sinks designed using computer simulations to maximize the transfer of thermal energy can be fabricated using additive manufacturing (AM) methods, such as selective laser melting (SLM).
With the goal of studying the effects of heat sink topology optimization for TES, the thermal performance and melting characteristic of a TO heat sink that was conduction-optimized, was compared against that of a conventional pin fin heat sink. For a fair comparison, the conventional heat sink was designed with the same volume, surface area and overall dimensions as the TO heat sink. The heat sinks were made of AlSi10Mg and fabricated using SLM. The heat sink performances were evaluated by melting a fixed mass of RT35, an organic PCM with a melting temperature range of 32-38°C, while supplied with a constant temperature heat source. The experiments were carried out with the constant temperature heat source at 65°C, 70°C and 75°C. Data from thermocouples, images and PCM mass were used for analysis.
The experiment results show that the TO heat sink design led to faster PCM melt times and lower peak base plate temperatures. When a constant plate temperature of 65°C was applied, PCM melt times were lowered by 11.4%, while peak base plate temperatures were lowered by 4.5°C when compared to the conventional heat sink design. The unique topology of the TO heat sink results in even thermal energy distribution, allowing for faster and higher amounts of latent heat gain in the PCM, enhancing TES charging performance. |
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