Apply thermal conductive composites for thermal management of electronic device

The efficient thermal management of electronic devices is paramount for ensuring optimal performance and longevity. In this paper, we explored the application of boron nitride (BN) composites as promising candidates for enhancing thermal management in electronic devices. Through a comprehensive i...

Full description

Saved in:
Bibliographic Details
Main Author: Lee, Linus Wei Jie
Other Authors: Hortense Le Ferrand
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2024
Subjects:
Online Access:https://hdl.handle.net/10356/177880
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-177880
record_format dspace
spelling sg-ntu-dr.10356-1778802024-06-03T06:35:07Z Apply thermal conductive composites for thermal management of electronic device Lee, Linus Wei Jie Hortense Le Ferrand School of Mechanical and Aerospace Engineering Hortense@ntu.edu.sg Engineering The efficient thermal management of electronic devices is paramount for ensuring optimal performance and longevity. In this paper, we explored the application of boron nitride (BN) composites as promising candidates for enhancing thermal management in electronic devices. Through a comprehensive investigation employing scanning electron microscopy (SEM), surface roughness measurement analysis, and extensive experimental runs, we illustrated the influence of internal microstructure alignment on thermal performance. SEM imaging unveiled distinct conformation factors associated with different alignments within the microstructure of BN composites. Concurrently, surface roughness measurements provided valuable insights into the surface properties of these composites across various alignment configurations. Subsequent experimental runs simulated real-world conditions and yielded crucial parameters including maximum stable temperature, time to reach maximum stable temperature, initial heating rate, and cooling rate. Our findings reveal that BN composites with a vertical alignment exhibit superior thermal management capabilities compared to other alignments. Specifically, the vertically aligned composites showcased the lowest maximum stable temperature, fastest time to reach maximum stable temperature, highest initial heating rate, and highest cooling rate. These results underscore the significance of microstructure alignment in optimising thermal performance and suggest the potential of purposefully-induced alignment of BN composites for effective heat dissipation and thermal management in electronic devices. With the complexity of real-world electronic devices, BN composites fabricated using MASC could represent a promising and versatile solution for a wide variety of requirements and use-cases. Bachelor's degree 2024-06-03T06:35:07Z 2024-06-03T06:35:07Z 2024 Final Year Project (FYP) Lee, L. W. J. (2024). Apply thermal conductive composites for thermal management of electronic device. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/177880 https://hdl.handle.net/10356/177880 en A046 application/pdf Nanyang Technological University
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering
spellingShingle Engineering
Lee, Linus Wei Jie
Apply thermal conductive composites for thermal management of electronic device
description The efficient thermal management of electronic devices is paramount for ensuring optimal performance and longevity. In this paper, we explored the application of boron nitride (BN) composites as promising candidates for enhancing thermal management in electronic devices. Through a comprehensive investigation employing scanning electron microscopy (SEM), surface roughness measurement analysis, and extensive experimental runs, we illustrated the influence of internal microstructure alignment on thermal performance. SEM imaging unveiled distinct conformation factors associated with different alignments within the microstructure of BN composites. Concurrently, surface roughness measurements provided valuable insights into the surface properties of these composites across various alignment configurations. Subsequent experimental runs simulated real-world conditions and yielded crucial parameters including maximum stable temperature, time to reach maximum stable temperature, initial heating rate, and cooling rate. Our findings reveal that BN composites with a vertical alignment exhibit superior thermal management capabilities compared to other alignments. Specifically, the vertically aligned composites showcased the lowest maximum stable temperature, fastest time to reach maximum stable temperature, highest initial heating rate, and highest cooling rate. These results underscore the significance of microstructure alignment in optimising thermal performance and suggest the potential of purposefully-induced alignment of BN composites for effective heat dissipation and thermal management in electronic devices. With the complexity of real-world electronic devices, BN composites fabricated using MASC could represent a promising and versatile solution for a wide variety of requirements and use-cases.
author2 Hortense Le Ferrand
author_facet Hortense Le Ferrand
Lee, Linus Wei Jie
format Final Year Project
author Lee, Linus Wei Jie
author_sort Lee, Linus Wei Jie
title Apply thermal conductive composites for thermal management of electronic device
title_short Apply thermal conductive composites for thermal management of electronic device
title_full Apply thermal conductive composites for thermal management of electronic device
title_fullStr Apply thermal conductive composites for thermal management of electronic device
title_full_unstemmed Apply thermal conductive composites for thermal management of electronic device
title_sort apply thermal conductive composites for thermal management of electronic device
publisher Nanyang Technological University
publishDate 2024
url https://hdl.handle.net/10356/177880
_version_ 1800916289518043136