Analysis and design recommendations for structures strengthened by prestressed bonded Fe-SMA

• Main Authors: Li, Lingzhen, Wang, Sizhe, Chatzi, Eleni, Motavalli, Masoud, Ghafoori, Elyas
• Other Authors: Singapore Centre for 3D Printing
• Format: Article
• Language: English
• Published: 2024
• Subjects: Engineering; Iron-based shape memory alloy; Memory steel
• Online Access: https://hdl.handle.net/10356/178708
• Institution: Nanyang Technological University

Previous studies have demonstrated a great potential of prestressed strengthening of structures employing iron-based shape memory alloys (Fe-SMAs). A bonded Fe-SMA strengthening solution with partial activation has been proposed. However, an analytical model for assessing the strengthening efficiency was lacking, due to the unique nature of the employed prestressing mechanism involving heating. In this study, a symmetric strengthening model and an asymmetric strengthening model are developed to analyze the prestress level in steel and glass beams and plates strengthened by bonded Fe-SMA strips. The asymmetric strengthening model is then modified to analyze reinforced concrete (RC) beams strengthened by embedded Fe-SMA rebars. Recovery stress at different activation temperatures, the influence of the activation temperature on the adhesive bond, as well as the prestress loss resulting from the deformation of substrate elements and adhesive joints are taken into account. The predicted strains and deflections in the parent structure closely approximate the experimental measurements that appear in current literature. A parametric study and a sensitivity analysis are then conducted to assess the impact of the four influential features on the final prestress level, and their impact is ranked in the following order: recovery stress ≈ Fe-SMA width > activation length > bonded anchorage length. Based on these findings, a design strategy, in line with Eurocode 0, for the bonded/embedded Fe-SMA strengthening system is proposed. Finally, some perspectives on potential areas for future research are offered.