Development of carbon nanotubes for interconnection applications

This thesis records the development of carbon nanotubes (CNTs) material, fabrication techniques and process for interconnection application in very-large-scale integration (VLSI) and flip chip interconnects. For CNT to be used as VLSI interconnect, a self assembly fabrication technique for joining i...

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Bibliographic Details
Main Author: Yung, Wendy Ka Po
Other Authors: Wei Jun
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:https://hdl.handle.net/10356/18692
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Institution: Nanyang Technological University
Language: English