Report on industrial attachment with Institute of Microelectronics
This report describes the project carried out during the author’s 22-week Industrial Attachment with Institute of Microelectronics, A*STAR, Singapore. The main objective of this project is to design a 2.5Gbps transceiver module for short-reach POF application. Three major areas have been discussed:...
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sg-ntu-dr.10356-191632023-07-07T15:49:27Z Report on industrial attachment with Institute of Microelectronics Wang, Ting. School of Electrical and Electronic Engineering Zhang Jing DRNTU::Engineering::Electrical and electronic engineering This report describes the project carried out during the author’s 22-week Industrial Attachment with Institute of Microelectronics, A*STAR, Singapore. The main objective of this project is to design a 2.5Gbps transceiver module for short-reach POF application. Three major areas have been discussed: the electrical transceiver module designs, the corresponding PCB designs, and the characterization of the transceiver. Two designs are involved: one is utilizing commercial IC chips for the circuitry design testing and another is utilizing the CMOS IC chips designed by IME internally. Only the former board is assembled and characterized. The results are interpreted and discussed in this project. They can show that the transceiver is able to perform well in the 2.5Gbps operation. However, future modifications are required for a more efficient transceiver design, especially for the IME CMOS POF transceiver design. 0 2009-10-26T00:52:30Z 2009-10-26T00:52:30Z 2008 2008 Industrial Attachment (IA) http://hdl.handle.net/10356/19163 en Nanyang Technological University 97 p. application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering Wang, Ting. Report on industrial attachment with Institute of Microelectronics |
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This report describes the project carried out during the author’s 22-week Industrial Attachment with Institute of Microelectronics, A*STAR, Singapore. The main objective of this project is to design a 2.5Gbps transceiver module for short-reach POF application. Three major areas have been discussed: the electrical transceiver module designs, the corresponding PCB designs, and the characterization of the transceiver. Two designs are involved: one is utilizing commercial IC chips for the circuitry design testing and another is utilizing the CMOS IC chips designed by IME internally. Only the former board is assembled and characterized. The results are interpreted and discussed in this project. They can show that the transceiver is able to perform well in the 2.5Gbps operation. However, future modifications are required for a more efficient transceiver design, especially for the IME CMOS POF transceiver design. |
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School of Electrical and Electronic Engineering |
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School of Electrical and Electronic Engineering Wang, Ting. |
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Industrial Attachment (IA) |
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Wang, Ting. |
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Wang, Ting. |
title |
Report on industrial attachment with Institute of Microelectronics |
title_short |
Report on industrial attachment with Institute of Microelectronics |
title_full |
Report on industrial attachment with Institute of Microelectronics |
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Report on industrial attachment with Institute of Microelectronics |
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Report on industrial attachment with Institute of Microelectronics |
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report on industrial attachment with institute of microelectronics |
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2009 |
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http://hdl.handle.net/10356/19163 |
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1772825515160240128 |