Biomolecules for nanodevice applications

The density of devices needs to be integrated into various systems increases with the advancement in technology. In order to integrate high density of devices, smaller feature size down to nanometer level has to be achieved. With the current technology, copper may no longer be suitable as interconne...

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Main Author: Yew, Sok Yee
Other Authors: Lam Yeng Ming
Format: Theses and Dissertations
Language:English
Published: 2009
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Online Access:https://hdl.handle.net/10356/19305
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-193052023-03-04T16:47:34Z Biomolecules for nanodevice applications Yew, Sok Yee Lam Yeng Ming Subodh Gautam Mhaisalkar School of Materials Science & Engineering DRNTU::Engineering::Materials::Biomaterials The density of devices needs to be integrated into various systems increases with the advancement in technology. In order to integrate high density of devices, smaller feature size down to nanometer level has to be achieved. With the current technology, copper may no longer be suitable as interconnect material due to the increase in resistance as the size of the interconnect shrinks and there is an increasing need to explore new materials with novel electron transport properties. Many work has been done on the optical interconnects and the carbon nanotube interconnects as alternatives to the conventional copper interconnects. However, both of these areas have their own limitations. In this dissertation, peptides are explored as an alternative. The electrical properties of these peptides will be tested, discussed and evaluated with the aim to use the peptides as future interconnects. The main motivation for the use of peptides as an alternative for interconnect arises from the fact that peptides can be readily self assembled in solution onto silicon wafer or any other substrates by controlling the surface chemistry. Self assembly is a fast and cheap process to create interconnects. The peptides will have specific covalent bonding to the substrate unlike carbon nanotube interconnects. In addition, peptide forms atomically precise chain length and the length of the peptide can be varied by changing the number of monomer repeats. The peptides can consist of amino acids which have different functional groups for attachment to specific substrate. For example, cysteine would attach to gold, histidine to nickel and alanine to NH2 functionalized silicon. In this work on peptides, there are also cysteine and cysteine interaction between the neighbouring peptides, resulting in the formation of disulfide bond. This disulfide bond brings the self assembled peptides closer together forming a highly packed layer. The short distance between the self assembled short peptides resulted in conjugated phenyl rings that give rise to possible charge transportation. MASTER OF ENGINEERING (MSE) 2009-12-03T08:05:43Z 2009-12-03T08:05:43Z 2009 2009 Thesis Yew, S. Y. (2009). Biomolecules for nanodevice applications. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/19305 10.32657/10356/19305 en 83 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials::Biomaterials
spellingShingle DRNTU::Engineering::Materials::Biomaterials
Yew, Sok Yee
Biomolecules for nanodevice applications
description The density of devices needs to be integrated into various systems increases with the advancement in technology. In order to integrate high density of devices, smaller feature size down to nanometer level has to be achieved. With the current technology, copper may no longer be suitable as interconnect material due to the increase in resistance as the size of the interconnect shrinks and there is an increasing need to explore new materials with novel electron transport properties. Many work has been done on the optical interconnects and the carbon nanotube interconnects as alternatives to the conventional copper interconnects. However, both of these areas have their own limitations. In this dissertation, peptides are explored as an alternative. The electrical properties of these peptides will be tested, discussed and evaluated with the aim to use the peptides as future interconnects. The main motivation for the use of peptides as an alternative for interconnect arises from the fact that peptides can be readily self assembled in solution onto silicon wafer or any other substrates by controlling the surface chemistry. Self assembly is a fast and cheap process to create interconnects. The peptides will have specific covalent bonding to the substrate unlike carbon nanotube interconnects. In addition, peptide forms atomically precise chain length and the length of the peptide can be varied by changing the number of monomer repeats. The peptides can consist of amino acids which have different functional groups for attachment to specific substrate. For example, cysteine would attach to gold, histidine to nickel and alanine to NH2 functionalized silicon. In this work on peptides, there are also cysteine and cysteine interaction between the neighbouring peptides, resulting in the formation of disulfide bond. This disulfide bond brings the self assembled peptides closer together forming a highly packed layer. The short distance between the self assembled short peptides resulted in conjugated phenyl rings that give rise to possible charge transportation.
author2 Lam Yeng Ming
author_facet Lam Yeng Ming
Yew, Sok Yee
format Theses and Dissertations
author Yew, Sok Yee
author_sort Yew, Sok Yee
title Biomolecules for nanodevice applications
title_short Biomolecules for nanodevice applications
title_full Biomolecules for nanodevice applications
title_fullStr Biomolecules for nanodevice applications
title_full_unstemmed Biomolecules for nanodevice applications
title_sort biomolecules for nanodevice applications
publishDate 2009
url https://hdl.handle.net/10356/19305
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