發送短信 : Computer vision approaches for automatic inspection of wire bonding of semiconductor devices

 ______      ___     __   _      ___    __    __  
|      \\   / _ \\  | || | ||   / _ \\  \ \\ / // 
|  --  //  / //\ \\ | '--' ||  / //\ \\  \ \/ //  
|  --  \\ |  ___  ||| .--. || |  ___  ||  \  //   
|______// |_||  |_|||_|| |_|| |_||  |_||   \//    
`------`  `-`   `-` `-`  `-`  `-`   `-`     `