Computer vision approaches for automatic inspection of wire bonding of semiconductor devices

• المؤلف الرئيسي: Lim, Han Ooi.
• مؤلفون آخرون: Koh, Liang Mong
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/19635

There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. This thesis shows that simple image processing technique can b...