Reliability study of copper wire bonding and through silicon via

• Main Author: Chan, Marvin Jiawei
• Other Authors: Tan, Chuan Seng
• Format: Thesis-Doctor of Philosophy
• Language: English
• Published: Nanyang Technological University 2020
• Subjects: Engineering::Electrical and electronic engineering::Electronic packaging; Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: https://hdl.handle.net/10356/142271
• Institution: Nanyang Technological University

Interconnects are necessary for the electrical connection of an integrated circuits (IC). Therefore, its quality and reliability are vitally important to ensure that a device is working as it is intendedly designed. The continued scaling of devices and the desire for higher functionality and capabil...