Computer vision approaches for automatic inspection of wire bonding of semiconductor devices

• Main Author: Lim, Han Ooi.
• Other Authors: Koh, Liang Mong
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
• Online Access: http://hdl.handle.net/10356/19635
• Institution: Nanyang Technological University

There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. This thesis shows that simple image processing technique can b...