Computer vision approaches for automatic inspection of wire bonding of semiconductor devices
There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. This thesis shows that simple image processing technique can b...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/19635 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. This thesis shows that simple image processing technique can be applied to perform
the inspection automatically. The operators need only to place the lead frame of the
integrated circuit at a reference location on the X-Y table and press a button on the
keyboard. The system will take care of the alignment, focusing, height measurement
and diameter measurement of the bonding balls on the integrated circuit. |
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