Marking of IC packages with a pulsed Nd : YAG laser

The Taguchi method has been used to identify the optimal process parameters of marking integrated circuit (IC) packages with a 400 W flashlamp-pumped pulsed Nd:YAG laser that is incorporated onto a Maho Lasercav 5-axis CNC (Computer-Numerical-Control) machine. Three types of packages, namely, the le...

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Main Author: Yusoff Mohamed Noor.
Other Authors: Lim, Enk Ng Lennie
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19901
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Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-19901
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spelling sg-ntu-dr.10356-199012023-03-11T17:24:09Z Marking of IC packages with a pulsed Nd : YAG laser Yusoff Mohamed Noor. Lim, Enk Ng Lennie School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing The Taguchi method has been used to identify the optimal process parameters of marking integrated circuit (IC) packages with a 400 W flashlamp-pumped pulsed Nd:YAG laser that is incorporated onto a Maho Lasercav 5-axis CNC (Computer-Numerical-Control) machine. Three types of packages, namely, the leadless chip carriers, ceramic packages, and epoxy packages have been marked successfully. Master of Engineering (MPE) 2009-12-14T07:07:32Z 2009-12-14T07:07:32Z 1993 1993 Thesis http://hdl.handle.net/10356/19901 en NANYANG TECHNOLOGICAL UNIVERSITY 293 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Yusoff Mohamed Noor.
Marking of IC packages with a pulsed Nd : YAG laser
description The Taguchi method has been used to identify the optimal process parameters of marking integrated circuit (IC) packages with a 400 W flashlamp-pumped pulsed Nd:YAG laser that is incorporated onto a Maho Lasercav 5-axis CNC (Computer-Numerical-Control) machine. Three types of packages, namely, the leadless chip carriers, ceramic packages, and epoxy packages have been marked successfully.
author2 Lim, Enk Ng Lennie
author_facet Lim, Enk Ng Lennie
Yusoff Mohamed Noor.
format Theses and Dissertations
author Yusoff Mohamed Noor.
author_sort Yusoff Mohamed Noor.
title Marking of IC packages with a pulsed Nd : YAG laser
title_short Marking of IC packages with a pulsed Nd : YAG laser
title_full Marking of IC packages with a pulsed Nd : YAG laser
title_fullStr Marking of IC packages with a pulsed Nd : YAG laser
title_full_unstemmed Marking of IC packages with a pulsed Nd : YAG laser
title_sort marking of ic packages with a pulsed nd : yag laser
publishDate 2009
url http://hdl.handle.net/10356/19901
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