Contact-displacement PD deposition for electroless copper application

• Main Author: Lau, Ping Ping
• Other Authors: Wong Chee Cheong
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: https://hdl.handle.net/10356/20632
• Institution: Nanyang Technological University

Electroless (EL) Cu, a potential seed layer material for Cu interconnects used in nanoelectronics, is intimately dependent on the surface activation of catalytic Pd particles. A comprehensive understanding on the deposition mechanism of Pd particles is thus critically important. In this thesis, the...