Report on industrial attachment with IME (Institute of Microelectronics)

This project consists of three main parts: Characterization of Bio-MEMS Chips, Design and Prototyping of the Low-noise Amplifier, and Testing the Amplifier with MEMS Chips. And the main objective of this project is to study the Patch Clamp experiment by using MEMS methods.

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Bibliographic Details
Main Author:	Zhu, Jia.
Other Authors:	School of Electrical and Electronic Engineering
Format:	Industrial Attachment (IA)
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering
Online Access:	http://hdl.handle.net/10356/3083
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-3083
record_format	dspace
spelling	sg-ntu-dr.10356-30832023-07-07T15:43:50Z Report on industrial attachment with IME (Institute of Microelectronics) Zhu, Jia. School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering This project consists of three main parts: Characterization of Bio-MEMS Chips, Design and Prototyping of the Low-noise Amplifier, and Testing the Amplifier with MEMS Chips. And the main objective of this project is to study the Patch Clamp experiment by using MEMS methods. 2008-09-17T09:20:19Z 2008-09-17T09:20:19Z 2004 2004 Industrial Attachment (IA) http://hdl.handle.net/10356/3083 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering Zhu, Jia. Report on industrial attachment with IME (Institute of Microelectronics)
description	This project consists of three main parts: Characterization of Bio-MEMS Chips, Design and Prototyping of the Low-noise Amplifier, and Testing the Amplifier with MEMS Chips. And the main objective of this project is to study the Patch Clamp experiment by using MEMS methods.
author2	School of Electrical and Electronic Engineering
author_facet	School of Electrical and Electronic Engineering Zhu, Jia.
format	Industrial Attachment (IA)
author	Zhu, Jia.
author_sort	Zhu, Jia.
title	Report on industrial attachment with IME (Institute of Microelectronics)
title_short	Report on industrial attachment with IME (Institute of Microelectronics)
title_full	Report on industrial attachment with IME (Institute of Microelectronics)
title_fullStr	Report on industrial attachment with IME (Institute of Microelectronics)
title_full_unstemmed	Report on industrial attachment with IME (Institute of Microelectronics)
title_sort	report on industrial attachment with ime (institute of microelectronics)
publishDate	2008
url	http://hdl.handle.net/10356/3083
_version_	1772828023105519616

Report on industrial attachment with IME (Institute of Microelectronics)

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