UV/EB curing of epoxy-based composites Epiclon HP-820 and Epolam 5015

• Main Author: Seah, Javien Jin Ping.
• Other Authors: Marc Jean Medard Abadie
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/35669
• Institution: Nanyang Technological University

UV and e-beam curing of epoxy resin has been extensively researched on due to its significant advantages in the coating, electronic, inks and adhesives industrial applications. Epoxy adopts cationic photo-polymerization primarily due to its functional group, as well as holding numerous advantages over free radical photo-polymerization. For this project, characterization of curing Epiclon HP-820 and co-solvent EPOLAM 5015 at various compositions using CyracureUVI-6976 was studied. The use of Differential PhotoCalorimetry (DPC), Dynamic Mechanical Analyzer (DMA) and INTRON 5567 was to determine the kinetics parameters, Glass Transition Temperature (Tg) and Tensile Strength respectively. Results showed in terms of kinetics, activation energy of HP-820 is higher than EPOLAM 5015 and conversion fraction and rate are dependent on temperature. Fabrication of pure HP-820 samples failed due to great adhesion. HP-820 showed to be more prone to UV degradation and air bubble formation than EPOLAM 5015. Tg varies linearly with composition of the mixture, with more HP-820 lessening Tg. Similarly, concentration of HP-820 produces lower tensile strength product. E-beam curing has been unsuccessful due to thickness of samples to be cured. Finally, a list of recommendations is given to improve on more accurate, consistent and in-depth study on the curing behavior of Epiclon HP-820.