Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication

73 p.

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Bibliographic Details
Main Author:	Lim, Patricia Li Ying.
Other Authors:	Zhong Zhaowei
Format:	Theses and Dissertations
Published:	2010
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/35992
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-35992
record_format	dspace
spelling	sg-ntu-dr.10356-359922023-03-11T17:05:11Z Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication Lim, Patricia Li Ying. Zhong Zhaowei School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing 73 p. Low temperature co-fired ceramics (LTCCs) are becoming increasingly important in the electronic circuit board fabrication as a result of the introduction of hybrid microelectronics packaging. Here, a novel class of deposition technique developed for the LTCC substrate is presented. This method enables the integration of metal printing and electroless metal plating processes to be realized. Master of Science (Precision Engineering) 2010-04-23T02:22:19Z 2010-04-23T02:22:19Z 2007 2007 Thesis http://hdl.handle.net/10356/35992 application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Lim, Patricia Li Ying. Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
description	73 p.
author2	Zhong Zhaowei
author_facet	Zhong Zhaowei Lim, Patricia Li Ying.
format	Theses and Dissertations
author	Lim, Patricia Li Ying.
author_sort	Lim, Patricia Li Ying.
title	Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
title_short	Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
title_full	Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
title_fullStr	Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
title_full_unstemmed	Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
title_sort	evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
publishDate	2010
url	http://hdl.handle.net/10356/35992
_version_	1761781775902703616

Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication

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