Interfacial studies of AlN-cordierite composite

The growing momentum within the electronic industry towards miniaturisation increased circuit densities, higher speeds and more powerful chips has cause the industry to look for better packaging material that have good thermal conductivity for adequate heat dissipation and low dielectric constant f...

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Bibliographic Details
Main Author: Lum, Jun Ming.
Other Authors: Oh Joo Tien
Format: Final Year Project
Language:English
Published: 2010
Subjects:
Online Access:http://hdl.handle.net/10356/38718
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Institution: Nanyang Technological University
Language: English
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