Thermosyphon cooling system for high heat flux electronic components

• Main Author: Koh, Zheng Jie.
• Other Authors: Leong Kai Choong
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Mechanical engineering::Energy conservation
• Online Access: http://hdl.handle.net/10356/40526
• Institution: Nanyang Technological University

Over the years, heat fluxes from high speed electronic devices are increasing at an alarming rate and have now, reached levels where air and liquid cooling can no longer handle. The use of two-phase cooling in thermosyphons has proven to be the potential alternative in managing high heat lo...