Development of novel ceramic composites for heat management of advanced electronic devices
Advanced photolithography (stepper technology) and multilayer technology have brought the semiconductor industry into a real very-large-scale integration (VLSI) era. The technologies have made it possible for millions of electronic elements to be integrated in a very small chip. The integration i...
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sg-ntu-dr.10356-425392020-09-27T20:14:37Z Development of novel ceramic composites for heat management of advanced electronic devices Zhang, Wei Da Peter Hing School of Applied Science DRNTU::Engineering::Materials::Composite materials Advanced photolithography (stepper technology) and multilayer technology have brought the semiconductor industry into a real very-large-scale integration (VLSI) era. The technologies have made it possible for millions of electronic elements to be integrated in a very small chip. The integration is expected to reach billions soon. One major aspect of an individual electronic transistor or other elements in the VLSI circuits is that it has a very small size and consumes a very little power so that it can attain very high speed of operation. It also consumes little power. Master of Applied Science 2010-12-30T03:42:40Z 2010-12-30T03:42:40Z 1999 1999 Thesis http://hdl.handle.net/10356/42539 en 147 p. application/pdf |
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DRNTU::Engineering::Materials::Composite materials Zhang, Wei Da Development of novel ceramic composites for heat management of advanced electronic devices |
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Advanced photolithography (stepper technology) and multilayer technology have
brought the semiconductor industry into a real very-large-scale integration (VLSI) era.
The technologies have made it possible for millions of electronic elements to be
integrated in a very small chip. The integration is expected to reach billions soon. One major aspect of an individual electronic transistor or other elements in the VLSI circuits is that it has a very small size and consumes a very little power so that it can attain very high speed of operation. It also consumes little power. |
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Peter Hing |
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Peter Hing Zhang, Wei Da |
format |
Theses and Dissertations |
author |
Zhang, Wei Da |
author_sort |
Zhang, Wei Da |
title |
Development of novel ceramic composites for heat management of advanced electronic devices |
title_short |
Development of novel ceramic composites for heat management of advanced electronic devices |
title_full |
Development of novel ceramic composites for heat management of advanced electronic devices |
title_fullStr |
Development of novel ceramic composites for heat management of advanced electronic devices |
title_full_unstemmed |
Development of novel ceramic composites for heat management of advanced electronic devices |
title_sort |
development of novel ceramic composites for heat management of advanced electronic devices |
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2010 |
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http://hdl.handle.net/10356/42539 |
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1681056718455308288 |