Plastic heat sink

Plastic can be an ideal heat sink material as it is light and can be stronger than steel. Properties of plastic can hinder the application of heat sink due to the fact that it is a poor thermal conductor. With the implementation of fillers in plastic, composite polymer will be able to solve the ther...

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Main Author: Tan, Cornelius Ming Han.
Other Authors: Tan Cher Ming
Format: Final Year Project
Language:English
Published: 2011
Subjects:
Online Access:http://hdl.handle.net/10356/45012
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-450122023-07-07T16:37:22Z Plastic heat sink Tan, Cornelius Ming Han. Tan Cher Ming School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation Plastic can be an ideal heat sink material as it is light and can be stronger than steel. Properties of plastic can hinder the application of heat sink due to the fact that it is a poor thermal conductor. With the implementation of fillers in plastic, composite polymer will be able to solve the thermal conductivity issues. The research focuses on making the filler and polymer matrix a miscible blend such that the cross linkages will facilitate the heat load transfer. The fillers will have to undergo synthesis to create a chemical bond between the fillers and the polymer matrix such as attaching functional group during polymerization. This chemical bond is necessary to create the cross linkages between the fillers and plastic composite to enhance thermal conductivity. The performances of plastic heat sinks are also determined by thermal imaging heat scans and evaluation of performance of light emitting diode when mounted on the plastic heat sinks. Plastic heat sink model is created to correlate heat dissipation with thermal conductivity. Comparison of heat dissipation pattern in metal and plastic heat sink is also studied. Bachelor of Engineering 2011-06-08T03:32:58Z 2011-06-08T03:32:58Z 2011 2011 Final Year Project (FYP) http://hdl.handle.net/10356/45012 en Nanyang Technological University 72 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
Tan, Cornelius Ming Han.
Plastic heat sink
description Plastic can be an ideal heat sink material as it is light and can be stronger than steel. Properties of plastic can hinder the application of heat sink due to the fact that it is a poor thermal conductor. With the implementation of fillers in plastic, composite polymer will be able to solve the thermal conductivity issues. The research focuses on making the filler and polymer matrix a miscible blend such that the cross linkages will facilitate the heat load transfer. The fillers will have to undergo synthesis to create a chemical bond between the fillers and the polymer matrix such as attaching functional group during polymerization. This chemical bond is necessary to create the cross linkages between the fillers and plastic composite to enhance thermal conductivity. The performances of plastic heat sinks are also determined by thermal imaging heat scans and evaluation of performance of light emitting diode when mounted on the plastic heat sinks. Plastic heat sink model is created to correlate heat dissipation with thermal conductivity. Comparison of heat dissipation pattern in metal and plastic heat sink is also studied.
author2 Tan Cher Ming
author_facet Tan Cher Ming
Tan, Cornelius Ming Han.
format Final Year Project
author Tan, Cornelius Ming Han.
author_sort Tan, Cornelius Ming Han.
title Plastic heat sink
title_short Plastic heat sink
title_full Plastic heat sink
title_fullStr Plastic heat sink
title_full_unstemmed Plastic heat sink
title_sort plastic heat sink
publishDate 2011
url http://hdl.handle.net/10356/45012
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