CAD software package for noise reduction in MCM layout design
The aim of this project is to develop a window based software that simulates or predicts noise performance in a multi-chip module. The analysis results would allow development of techniques to reduce the noises. CAD packages would subsequently be developed using these techniques for the optimisation...
Saved in:
主要作者: | |
---|---|
其他作者: | |
格式: | Theses and Dissertations |
出版: |
2008
|
主題: | |
在線閱讀: | http://hdl.handle.net/10356/4503 |
標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
機構: | Nanyang Technological University |