Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices

In the field of hot embossing of polymers for microfluidic, there is a lack of study into the relationships of bonding strength and bonding toughness with regard to the different bonding parameters. This project aims to explore the relationship of bonding strength and toughness under different pa...

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Bibliographic Details
Main Author: Toh, Ming Loon.
Other Authors: Yue Chee Yoon
Format: Final Year Project
Language:English
Published: 2011
Subjects:
Online Access:http://hdl.handle.net/10356/45245
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Institution: Nanyang Technological University
Language: English