Optimization of hot embossing parameters in the microfabrication of COC microfluidic device
Since the commercialization of microtechnology, low cost production together with reliable and efficient fabrication techniques has become the top deciding factors among manufacturers. The effectiveness of hot embossing micro features onto polymer substrate has been proven by past research....
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project |
| Language: | English |
| Published: |
2011
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/45259 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | Since the commercialization of microtechnology, low cost production together with reliable
and efficient fabrication techniques has become the top deciding factors among
manufacturers. The effectiveness of hot embossing micro features onto polymer substrate
has been proven by past research. However, the replication quality differs with varying key
process parameters such as embossing temperature, pressure (load) and holding time.
Hence, the next challenge is to develop a systematic way of optimizing the process
parameters with a goal of obtaining consistently good replication quality.
The purpose of the project is to investigate the effects and optimize the 3 key hot embossing
parameters. The Design of Experiments (DOE), particularly 2k experiment is used to screen
the effects of these parameters while the optimization method (where further experiments
are carried out) to obtain the minimum demolding energy with good replication channel
quality. Excessive demolding energy is undesirable because it means that the specimen is
subjected to large thermal stresses which may hamper good channel definition. |
|---|