Grinding of silicon wafer for molding applications

• Main Author: Sia, Kai Ming.
• Other Authors: Tor Shu Beng
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Mechanical engineering::Machine shop and drawings
• Online Access: http://hdl.handle.net/10356/45995
• Institution: Nanyang Technological University

This project deals with grinding the sides of a silicon wafer chip to a 10° angle, whilst achieving a good surface roughness and low subsurface damage. The experiment was conducted on a conventional sanding machine, where there is a fixture fixed in the z axis to the platform. The fixture has x...