Grinding of silicon wafer for molding applications

• المؤلف الرئيسي: Sia, Kai Ming.
• مؤلفون آخرون: Tor Shu Beng
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Mechanical engineering::Machine shop and drawings
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/45995
• المؤسسة: Nanyang Technological University

This project deals with grinding the sides of a silicon wafer chip to a 10° angle, whilst achieving a good surface roughness and low subsurface damage. The experiment was conducted on a conventional sanding machine, where there is a fixture fixed in the z axis to the platform. The fixture has x...