Grinding of silicon wafer for molding applications

• 主要作者: Sia, Kai Ming.
• 其他作者: Tor Shu Beng
• 格式: Final Year Project
• 語言: English
• 出版: 2011
• 主題: DRNTU::Engineering::Mechanical engineering::Machine shop and drawings
• 在線閱讀: http://hdl.handle.net/10356/45995

This project deals with grinding the sides of a silicon wafer chip to a 10° angle, whilst achieving a good surface roughness and low subsurface damage. The experiment was conducted on a conventional sanding machine, where there is a fixture fixed in the z axis to the platform. The fixture has x...