Single and two phase heat transfer in novel porous foams

The rapid development of technology in the last decades brings increased challenges in the cooling of electronic devices. Densely packed electronic systems require more effective methods to dissipate the heat generated by the chips and circuits. Porous media with high effective thermal conductivity...

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Bibliographic Details
Main Author: Li, Hongying
Other Authors: Leong Kai Choong
Format: Theses and Dissertations
Language:English
Published: 2011
Subjects:
Online Access:https://hdl.handle.net/10356/46544
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Institution: Nanyang Technological University
Language: English