Chip-package codesign of 5 GHz RF receiver front end
170 p.
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sg-ntu-dr.10356-469492023-07-04T16:10:09Z Chip-package codesign of 5 GHz RF receiver front end Wang, Junjun Zhang Yue Ping School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio 170 p. Nowadays, the demand for smaller and lighter portable electronics is driving both the semiconductor and packaging industries to increase integration density for radio frequency (RF) transceivers. Chip-package codesign opens a new era for integration, as the package is now part of the circuit. However, there are many problems to be solved for chip-package codesign. DOCTOR OF PHILOSOPHY (EEE) 2011-12-27T05:48:46Z 2011-12-27T05:48:46Z 2006 2006 Thesis Wang, J. J. (2006). Chip-package codesign of 5 GHz RF receiver front end. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/46949 10.32657/10356/46949 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio Wang, Junjun Chip-package codesign of 5 GHz RF receiver front end |
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170 p. |
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Zhang Yue Ping |
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Zhang Yue Ping Wang, Junjun |
format |
Theses and Dissertations |
author |
Wang, Junjun |
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Wang, Junjun |
title |
Chip-package codesign of 5 GHz RF receiver front end |
title_short |
Chip-package codesign of 5 GHz RF receiver front end |
title_full |
Chip-package codesign of 5 GHz RF receiver front end |
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Chip-package codesign of 5 GHz RF receiver front end |
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Chip-package codesign of 5 GHz RF receiver front end |
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chip-package codesign of 5 ghz rf receiver front end |
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2011 |
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https://hdl.handle.net/10356/46949 |
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1772827314344689664 |