Novel integrated circuit laminated ceramic package antenna
This dissertation presents designs of a meander type of antenna that is integrated on a 48-ball grid array (BGA) package for the single-chip solution of wireless transceivers, and explored methods to design the small physical size of the meander antenna.
Saved in:
Main Author: | Lin, Wei. |
---|---|
Other Authors: | Zhang, Yue Ping |
Format: | Theses and Dissertations |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/4711 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Novel integrated circuit pressed ceramic package antenna
by: Xue, Yang
Published: (2008) -
Integrated circuit package antenna
by: Li, Wenbo.
Published: (2008) -
Design and integration of 60-GHz grid array antenna in chip package
by: Sun, Mei, et al.
Published: (2010) -
Integrated RF front-end circuits and antennas for next generation wireless communication systems
by: Tan, Eng Leong.
Published: (2008) -
Design of an integrated radome-antenna system
by: Tan, Tony Tiong Hock
Published: (2021)