Carbon nanotubes based interconnect technology
85 p.
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2011
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| Online Access: | http://hdl.handle.net/10356/47217 |
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sg-ntu-dr.10356-472172023-03-11T17:02:59Z Carbon nanotubes based interconnect technology Devappa Shetty Kishan Miao Jianmin School of Mechanical and Aerospace Engineering MicroMachines Centre DRNTU::Engineering::Nanotechnology 85 p. With ever-increasing demands to shrink the dimensions of microelectronic devices, interconnect scaling has made limited advances in high-performance integrated circuits. Interconnect resistance and capacitance (also known as RCproduct) has become important parameters in determining integrated circuit design, design rules, packing density, and device performance. Interconnect delays must be minimized due to ever increasing needs for faster devices with low power consumption. Master of Science (Micro Electro Mechanical Systems Engineering) 2011-12-27T06:36:44Z 2011-12-27T06:36:44Z 2006 2006 Thesis http://hdl.handle.net/10356/47217 Nanyang Technological University application/pdf |
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Singapore Singapore |
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DRNTU::Engineering::Nanotechnology |
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DRNTU::Engineering::Nanotechnology Devappa Shetty Kishan Carbon nanotubes based interconnect technology |
| description |
85 p. |
| author2 |
Miao Jianmin |
| author_facet |
Miao Jianmin Devappa Shetty Kishan |
| format |
Theses and Dissertations |
| author |
Devappa Shetty Kishan |
| author_sort |
Devappa Shetty Kishan |
| title |
Carbon nanotubes based interconnect technology |
| title_short |
Carbon nanotubes based interconnect technology |
| title_full |
Carbon nanotubes based interconnect technology |
| title_fullStr |
Carbon nanotubes based interconnect technology |
| title_full_unstemmed |
Carbon nanotubes based interconnect technology |
| title_sort |
carbon nanotubes based interconnect technology |
| publishDate |
2011 |
| url |
http://hdl.handle.net/10356/47217 |
| _version_ |
1761781605738741760 |