Numerical investigations of PCM-cooled mobile devices

159 p.

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Bibliographic Details
Main Author: Govindan Radhakrishnan Kumaresh.
Other Authors: Tan Fock Lai
Format: Theses and Dissertations
Published: 2011
Subjects:
Online Access:http://hdl.handle.net/10356/47225
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-472252023-03-11T17:19:15Z Numerical investigations of PCM-cooled mobile devices Govindan Radhakrishnan Kumaresh. Tan Fock Lai School of Mechanical and Aerospace Engineering DRNTU::Engineering 159 p. The heating effect produced during their operation of mobile phone is hazardous. Hence, cooling of mobile phones plays a vital role in the design phase. Phase change materials (PCMs) can be used for cooling purpose since latent heat storage in PCM has high energy storage density. The melting temperature of n-eicosane at 36°C can maintain the heat source at much lower than the allowable temperature until the PCM is fully melted. The required amount of PCM was stored inside the heat storage unit (HSU) which is located strategically inside the mobile phone. The heat pipe, which has high effective thermal conductivity, can be used inside the mobile phone to transfer the heat from various heat sources inside the mobile phone to the other end of the heat pipe where the HSU containing the PCM is located. Master of Science (Mechanical Engineering) 2011-12-27T06:37:29Z 2011-12-27T06:37:29Z 2010 2010 Thesis http://hdl.handle.net/10356/47225 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering
spellingShingle DRNTU::Engineering
Govindan Radhakrishnan Kumaresh.
Numerical investigations of PCM-cooled mobile devices
description 159 p.
author2 Tan Fock Lai
author_facet Tan Fock Lai
Govindan Radhakrishnan Kumaresh.
format Theses and Dissertations
author Govindan Radhakrishnan Kumaresh.
author_sort Govindan Radhakrishnan Kumaresh.
title Numerical investigations of PCM-cooled mobile devices
title_short Numerical investigations of PCM-cooled mobile devices
title_full Numerical investigations of PCM-cooled mobile devices
title_fullStr Numerical investigations of PCM-cooled mobile devices
title_full_unstemmed Numerical investigations of PCM-cooled mobile devices
title_sort numerical investigations of pcm-cooled mobile devices
publishDate 2011
url http://hdl.handle.net/10356/47225
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