Stress calculation and failure prevention for microelectronics devices
This project presents a numerical investigation on the thermo-mechanical reliability of microelectronics devices. Thermo-mechanical reliability is one of the major bottlenecks for both current and future microelectronics devices. The current finial year project is to study the Stress Calculation and...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2012
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| Online Access: | http://hdl.handle.net/10356/47711 |
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| Institution: | Nanyang Technological University |
| Language: | English |