Report on effects of adding metal additives to aluminum oxide

• المؤلف الرئيسي: Chang, Jun Hua.
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials::Electronic packaging materials
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/49536

Aluminum oxide has been widely used in the electronics industry as a packaging and insulating material. For electronic packaging of harsh environment, which is in high temperature and extreme high atmospheric pressure, materials with high hardness, high fracture toughness and low thermal conductivit...